恭賀

工 工系許棟樑教授團隊參加: Joint Conference of the 3rd Global TRIZCON 2012 and International Conference on Systematic Innovation (第三屆全球萃智和系統化創新研討會) 與 Global Competition on Systematic Innovation (全球系統化創新競賽) 獲兩項創新專案金牌 如下：
    
Vacuum Device Mechanism for Wafer Breakage Avoidance By D. Daniel Sheu (許棟樑) & Jealousy Hong (洪柏璿)
Using TRIZ to Solve Lead Frame Delamination in Component Package By D. Daniel Sheu (許棟樑) & Yu -Chih Kuo (郭宇智)


                                             工學院 敬啟