11110E500100 College of Engineering Seminar
工學院英文書報討論

主題 TOPIC
▸　Low Temperature Inkjet Printing Ag Interconnect Technology for Flexible Microsystem Applications

摘要 Abstract
❝　Flexible microsystems have drawn lots of research attention recently due to great demands from personal portable devices. Several technologies have been developed for the realization of flexible microsystems. Nevertheless, inevitable high design and manufacturing complexity and process cost indicate more research effort is required in the development of flexible microsystem fabrication. In this talk, I will introduce an inkjet printing Ag interconnect technology for flexible microsystem applications. It is a platform technology to fabricate conductive interconnects with the characteristics of low-cost, low processing temperature, and size-scalable. Via printing and filling Ag nanoparticles in photopatterned molds, the technology can realize various microstructures including horizontal and vertical electrical interconnects, RLC passives, flexible biomedical sensors and actuators, etc. on a flexible substrate showing an alternative way to realize rapid and cost-effective on-site manufacture for IOT (Internet-of-Things) applications.　 ❞

講者 SPEAKER
▸　鄭裕庭教授 Prof. Yu-Ting CHENG
▸　國立陽明交通大學電子研究所 Institute of Electronics, National Yang Ming Chiao Tung University

主持 HOST
▸　李昇憲教授 Prof. Sheng-Shian LI
▸　國立清華大學奈米工程與微系統研究所 Institute of NanoEngineering & MicroSystem, National Tsing Hua University

時間 TIME
▸　2022/11/29 (TUE) 13:20 ~ 15:20

地點 VENUE
▸　工程一館106演講廳